型号:

BBS-130-G-A

RoHS:无铅 / 符合
制造商:Samtec Inc描述:CONN HEADR 30POS .100 PCB GOLD
详细参数
数值
产品分类 连接器,互连式 >> 板至板 - 接头,公引脚
BBS-130-G-A PDF
产品培训模块 Board-to-Board Connectors
产品目录绘图 BBS Series
特色产品 Board-To-Board Interconnect Systems
标准包装 1
系列 BBS
连接器类型 无罩
位置数 30
加载位置的数目 全部
间距 0.100"(2.54mm)
行数 1
行间距 -
高度堆叠(配接) -
超出电路板的模制高度 0.210"(5.33mm)
触点接合长度 0.125"(3.18mm)
安装类型 通孔
端子 焊接
触点表面涂层
触点涂层厚度 20µin(0.51µm)
特点 -
颜色
包装 散装
配套产品 SAM1126-30-ND - CONN RCPT .100" 30POS TIN WW R/A
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SAM1124-30-ND - CONN RCPT .100" 30PS GOLD WW R/A
SAM1123-30-ND - CONN RCPT .100" 30POS GOLD WW
SAM1122-30-ND - CONN RCPT .100" 30POS TIN PCB
SAM1121-30-ND - CONN RCPT .100" 30POS GOLD PCB
SAM1120-30-ND - CONN RCPT .100" 30POS TIN T/H
SAM1119-30-ND - CONN RCPT .100" 30POS TIN T/H
SAM1118-30-ND - CONN RCPT .100" 30POS GOLD T/H
SAM1117-30-ND - CONN RCPT .100" 30POS GOLD T/H
更多...
其它名称 SAM1004-30
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